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Course Co-ordinated by
IISc Bangalore
NPTEL
>>
Courses
>>
Electrical Engineering
>> An Introduction to Electronics Systems Packaging (Video) >>
Introduction and Objectives of the course
Question in Lecture
Overview of electronic systems packaging
Introduction and Objectives of the course
Definition of a system and history of semiconductors
Products and levels of packaging
Packaging aspects of handheld products; Case studies in applications
Case Study (continued); Definition of PWB, summary and Questions for review
Semiconductor Packaging Overview
Basics of Semiconductor and Process flowchart; Video on “Sand-to-Silicon”
Wafer fabrication, inspection and testing
Wafer packaging; Packaging evolution; Chip connection choices
Wire bonding, TAB and flipchip-1
Wire bonding, TAB and flipchip-2; Tutorials
Semiconductor Packages
Why packaging? & Single chip packages or modules (SCM)
Commonly used packages and advanced packages; Materials in packages
Advances packages (continued); Thermal mismatch in packages; Current trends in packaging
Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages
Electrical Design considerations in systems packaging
Electrical Issues – I; Resistive Parasitic
Electrical Issues – II; Capacitive and Inductive Parasitic
Electrical Issues – III; Layout guidelines and the Reflection problem
Electrical Issues – IV; Interconnection
CAD for Printed Wiring Boards
Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT
Components of a CAD package and its highlights
Design Flow considerations; Beginning a circuit design with schematic work and component layout
Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability
Printed Wiring Board Technologies: Board-level packaging aspects
Review of CAD output files for PCB fabrication; Photo plotting and mask generation
Process flow-chart; Vias; PWB substrates
Substrates continued; Video highlights; Surface preparation
Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs
PWB etching; Resist stripping; Screen-printing technology
Through-hole manufacture process steps; Panel and pattern plating methods
Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias
Microvia technology and Sequential build-up technology process flow for high-density interconnects
Conventional Vs HDI technologies; Flexible circuits; Tutorial session
Surface Mount Technology
SMD benefits; Design issues; Introduction to soldering
Reflow and Wave Soldering methods to attach SMDs
Solders; Wetting of solders; Flux and its properties; Defects in wave soldering
Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures
SMT failure library and Tin Whiskers
Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys
Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues
Thermal Design considerations in systems packaging
Thermal Design considerations in systems packaging
Embedded Passives Technology
Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes
Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging
Conclusion and Summary
Chapter-wise summary
Ask a Question
Question Topics :
Question:
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NOTE: Before you post question check if your question already exists.Please do not repeat questions.
All Questions
Question:
sir what about electrical machine 2 and Electrical And Electronics Measurements videos ?......we r waiting for video lectures of this subject...
By:
Imran D
Date:
2012-08-31
The co-ordinator will post his answer
Question:
hi sir, i am interested in packaging engineering.i completed B.Tech from electrical and electronics engg.I qualified in gate 2012.now i want to do M.tech. For this electronics packaging engg.subject which course i have to choose in M.Tech
By:
k.laxman yadav
Date:
2012-11-01
The co-ordinator will post his answer
Question:
hi sir, i am interested in packaging engineering.i completed B.Tech from electrical and electronics engg.I qualified in gate 2012.now i want to do M.tech. For this electronics packaging engg.subject which course i have to choose in M.Tech
By:
k.laxman yadav
Date:
2012-11-01
The co-ordinator will post his answer
All Questions for this Course
Question:
sir what about electrical machine 2 and Electrical And Electronics Measurements videos ?......we r waiting for video lectures of this subject...
By:
Imran D
Date:
2012-08-31
The co-ordinator will post his answer
Question:
hi sir, i am interested in packaging engineering.i completed B.Tech from electrical and electronics engg.I qualified in gate 2012.now i want to do M.tech. For this electronics packaging engg.subject which course i have to choose in M.Tech
By:
k.laxman yadav
Date:
2012-11-01
The co-ordinator will post his answer
Question:
hi sir, i am interested in packaging engineering.i completed B.Tech from electrical and electronics engg.I qualified in gate 2012.now i want to do M.tech. For this electronics packaging engg.subject which course i have to choose in M.Tech
By:
k.laxman yadav
Date:
2012-11-01
The co-ordinator will post his answer
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